Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Yong Liu (auth.)
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling.
Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each tasks unique characteristics.
Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each tasks unique characteristics.
Kategori:
Tahun:
2012
Edisi:
1
Penerbit:
Springer-Verlag New York
Bahasa:
english
Halaman:
594
ISBN 10:
1461410533
ISBN 13:
9781461410539
Fail:
PDF, 26.11 MB
IPFS:
,
english, 2012
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